Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)

A new technical paper titled “TIMtrace: Coverage Path Planning for Thermal Interface Materials” was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH.

Previous
Previous

Doping Mechanism Of Pure Nitric Oxide In Tungsten Diselenide Transistors (Purdue, MIT, NYCU)

Next
Next

Scientific Notes on Power Electronics: Product and Convolution of Fourier Series