Perspective on SerDes and CPO: PCB Material and Signal Routing Challenges Ahead

Written By Jae Park

How Will Material Innovation Become the Core Breakthrough for AI Infrastructure as SerDes Advances to 224G?

Jae Park
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Japanese team prepares to make SiC from chip waste
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Improving Machine Vision Efficiency with Global Shutter Image Sensor Technology / 글로벌 셔터 이미지 센서 기술로 머신 비전 효율성 향상