Japanese team prepares to make SiC from chip waste

For the last year Japanese chemical company Resonac and Tohoku University have been exploring using SiC powder, produced from sludge generated during silicon wafer manufacturing and carbon dioxide, as a raw material for the growth of SiC single-crystal materials used in power semiconductors.

Previous
Previous

Scientists break GaN HEMT limits using novel gate dielectric

Next
Next

Perspective on SerDes and CPO: PCB Material and Signal Routing Challenges Ahead