Technical Articles/Papers
Gain detailed insights into specific concepts, methodologies, and research findings, deepening your understanding of key issues and advancements within the semiconductor industry.
Scientific Notes on Power Electronics: The Principle of Superposition of Effects – Parseval Theorem
May 23, 2025 — Courtesy of Power Electronics News
In this tutorial, we will show that by writing the Fourier series expansion of a periodic signal in an intuitively obvious form, it is possible to interpret Parseval’s equality energetically.
The Evolution of Power Electronics in E-mobility Powertrain Applications
May 22, 2025 — Courtesy of Power Electronics News
The electrification of automobiles, transportation vehicles and the charging infrastructure required for these is seen as a key growth driver for power electronics.
Doping Mechanism Of Pure Nitric Oxide In Tungsten Diselenide Transistors (Purdue, MIT, NYCU)
May 22, 2025 — Courtesy of Semiconductor Engineering
A technical paper titled “Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors” was published by researchers at Purdue University, MIT and National Yang Ming Chiao Tung University (with support from Intel Corporation).
Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
May 21, 2025 — Courtesy of Semiconductor Engineering
A new technical paper titled “TIMtrace: Coverage Path Planning for Thermal Interface Materials” was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH.
Scientific Notes on Power Electronics: Product and Convolution of Fourier Series
May 19, 2025 — Courtesy of Power Electronics News
Convolution is a remarkable property of the Fourier transform, often cited in the literature as the “faltung theorem”. In this tutorial, we will show similar properties for the Fourier series and also for the ordinary product, completing the discussion with an application to a double half-wave rectifier.
GaN Power Devices, Perovskite Solar Cell, SiC IGBTs: Power Electronics Week Insights
May 13, 2025 — Courtesy of Power Electronics News
Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Gan Power Devices, Perovskite Solar Cell, and SiC IGBTs!
Also, check News Archives – Power Electronics News and Technical Articles Archives – Power Electronics News for the complete list of news and articles from our website.
Embedded GPU: An Open-Source And Configurable RISC-V GPU Platform for TinyAI Devices (EPFL)
May 14, 2025 — Courtesy of Semiconductor Engineering
A new technical paper titled “e-GPU: An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.
Empowering a Portable Future: How Low-Power Components Are Driving Innovation at the Edge
May 13, 2025 — Courtesy of EMSNow
As electronic devices become increasingly compact, intelligent, and mobile, the demand for low-power components is rising rapidly. From wearable medical devices to edge nodes in industrial IoT systems, engineers are now facing the challenge of achieving stable and efficient operation under stringent power constraints.
Resonant Gate Drivers for SiC Devices, Electronic Noise in Automotive, E-Mobility: Power Electronics Week Insights
May 12, 2025 — Courtesy of Power Electronics News
Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Resonant Gate Drivers for SiC Devices, Electronic Noise in Automotive, and E-Mobility!
Comparisons of HW Versus SW Implementation of Warp Level Features in Vortex RISC-V GPU
May 11, 2025 — Courtesy of Semiconductor Engineering
A new technical paper titled “Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU” was published by researchers at Georgia Tech and Indian Institute of Technology Bombay.
AI Drives Re-Engineering Of Nearly Everything In Chips
April 24, 2025 — Courtesy of Semiconductor Engineering
AI’s ability to mine patterns across massive quantities of data is causing fundamental changes in how chips are used, how they are designed, and how they are packaged and built.
Challenges of Chiplet Placement And Routing Optimization (KAIST)
April 23, 2025 — Courtesy of Semiconductor Engineering
A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST.
Optimising green LEDs for near-eye applications
April 9, 2025 — Courtesy of Compound Semiconductor
A common approach for producing commercial, high-current LEDs involves the inclusion of pre-well layers – these superlattices, featuring low-indium content layers, are inserted before the active region to aid strain engineering.
Production system for double-sided wafer probe test for silicon photonics
April 6, 2025 — Courtesy of Silicon Semiconductor
This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
How to Optimize MEMS IMU Data Coherence and Timing in Navigation Systems
April 3, 2025 — Courtesy of All4Chip (Korean Language)
For those evaluating inertial sensor solutions for the first time, existing compute and I/O resources can be limited in data rates and synchronization capabilities, making it difficult to properly field evaluate sensor capabilities.
Auto Sector Leads The Way In IC Security
April 3, 2025 — Courtesy of Semiconductor Engineering
Concerns about chip and system security are beginning to bear fruit in some markets, driven by the overlap in safety and security in automotive applications and the growing value of algorithms and complex systems in others. But how and when that security is implemented is still all over the map, and so is its effectiveness.
Asymmetric Transient Voltage Suppression Diodes for SiC Gate Protection
March 26, 2025 — Courtesy of Power Electronics News
This article highlights Littelfuse’s new family of asymmetric TVS diodes, designed for gate protection in SiC MOSFETs.
Scientific Notes on Power Electronics: Is It Possible to Make an Inverter with an RC Circuit?
March 24, 2025 — Courtesy of Power Electronics News
A simple RC circuit can’t function as an inverter, but a previous tutorial explored how an RC circuit’s output behaves when driven by an exponentially damped RLC circuit, offering insightful considerations.
The Great Debate at APEC 2025: GaN vs. SiC
March 24, 2025 —Courtesy of Power Electronics News
Wide-bandgap semiconductors—specifically gallium nitride and silicon carbide—are revolutionizing power electronics, enabling higher efficiency, smaller form factors, and greater performance in applications ranging from electric vehicles to data centers.
SiC MOSFETs, Global Battery Market, Power Solutions For Data Centers: Power Electronics Week Insights
March 21, 2025 — Courtesy of Power Electronics News
Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on SiC MOSFETs, Global Battery Market, and Power Solutions For Data Centers!
Wafer-Level Test Infrastructure for Higher Parallel Wafer Level Testing of SoC
March 3, 2025 — Courtesy of Semiconductor Engineering
A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne.
RISC-V High Performance Multicore and GPU SoC Platform For Safety Critical System
March 3, 2025 — Courtesy of Semiconductor Engineering
A new technical paper titled “A RISC-V Multicore and GPU SoC Platform with a Qualifiable Software Stack for Safety Critical Systems” published by researchers at Universitat Politecnica de Catalunya and Barcelona Supercomputing Center.
Global IC Fabs And Facilities Report: 2024
January 21, 2025 — Courtesy of Semiconductor Engineering
The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments came from both companies and government sources, and many CHIPS Act awards have now been finalized.
Auto Chip Aging Accelerates In Hot Climates
December 9, 2024 — Courtesy of Semiconductor Engineering
Automotive chips are aging significantly faster than expected in hot climates with sustained high temperatures, raising concerns about the reliability of electrified vehicles over time and whether advanced-node chips are the right choice for safety-critical applications.