Observing TSMC’s SiC Strategy ：SiC Enters the Advanced Packaging Mainstage

As the complexity and power demands of AI chip designs continue to escalate, Power Delivery Networks (PDNs) and thermal management have emerged as unavoidable core challenges for the industry. Traditional power delivery through PCBs or ABF substrates is becoming increasingly inadequate due to long power paths and high parasitic inductance, leading to IR drops and transient voltage droops. With single GPUs now requiring over 1000A of current, these legacy approaches are approaching their limits.