INDUSTRY NEWS
GlobalFoundries introduces 22FDX+ RRAM technology for wireless and AI applications
Courtesy of Silicon Semiconductor
Marvell unveils 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm
Courtesy of Silicon Semiconductor
AI in semiconductor manufacturing market to surpass $14.2 billion
Courtesy of Silicon Semiconductor
Tech, software, and semiconductor companies face the highest AI security risk in the S&P 500
Courtesy of Silicon Semiconductor
KASPA is not affiliated with any third-party events, organizations, or companies unless stated. News and announcements are sourced from company communications or shared directly by companies and media partners within the semiconductor ecosystem. Their inclusion is for informational purposes only and does not imply endorsement, partnership, or sponsorship by KASPA. All trademarks and company names are the property of their respective owners.

