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레조낙, 차세대 반도체 패키징 개발 위한 ‘JOINT3’ 컨소시엄 출범
Sep 4
Written By
Jae Park
Courtesy of All4Chip
Jae Park
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인피니언, 델타와 손잡고 데이터센터 전력 아키텍처 위한 고밀도 전력 모듈 개발
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GlobalFoundries introduces 22FDX+ RRAM technology for wireless and AI applications