INDUSTRY NEWS

Jae Park 5/6/25 Jae Park 5/6/25

Infineon expands GaN power with 650V modules

Courtesy of Compound Semiconductor

Jae Park 5/3/25 Jae Park 5/3/25

업계 최초 와이파이 완전 자동화 테스트 솔루션, 테스트 시간 최대 70% 단축

Courtesy of All4Chip

Jae Park 5/2/25 Jae Park 5/2/25

Titans of the global semiconductor industry to speak at CEO Summit

Courtesy of Silicon Semiconductor

Jae Park 5/1/25 Jae Park 5/1/25

인텔 파운드리, 주요 공정 로드맵, 첨단 패키징 기술 및 파트너십 발표

Courtesy of All4Chip

Jae Park 4/30/25 Jae Park 4/30/25

Infineon launches CoolSiC MOSFET 750V G2

Courtesy of Compound Semiconductor

Jae Park 4/30/25 Jae Park 4/30/25

삼성전자 1분기 실적, 최대 분기 매출 기록했지만 HBM 판매 감소로 실적 하락

Courtesy of elec4

Jae Park 4/29/25 Jae Park 4/29/25

엔비디아, 기업 생산성 강화하는 ‘네모 마이크로서비스’ 정식 출시

Courtesy of All4Chip

Jae Park 4/29/25 Jae Park 4/29/25

마우저 일렉트로닉스, 산업 자동화 분야의 첨단 기술 조명한 새로운 전자책 발간해

Courtesy of elec4

Jae Park 4/29/25 Jae Park 4/29/25

에브넷, AI 엑스포 코리아 2025에서 한국의 AI 비전을 위한 혁신 솔루션으로 AI 발전 견인

Courtesy of Semiconductor Network

Jae Park 4/28/25 Jae Park 4/28/25

Trump’s semiconductor tariffs threaten to affect US medical device industry growth

Courtesy of Silicon Semiconductor

Jae Park 4/28/25 Jae Park 4/28/25

마이크로칩, 아날로그 센서 설계 간소화하는 MCU 발표

Courtesy of elec4

Jae Park 4/25/25 Jae Park 4/25/25

로옴, OBC 디팩토 스탠다드 위한 높은 전력 밀도의 신형 SiC 모듈 발표

Courtesy of elec4

Jae Park 4/25/25 Jae Park 4/25/25

인텔, 멀티 노드 칩렛 아키텍처 기반의 차세대 SoC로 차량 혁신 가속화

Courtesy of All4Chip

Jae Park 4/24/25 Jae Park 4/24/25

TI, 차량의 자율성과 안전성을 향상시키는 새로운 차량용 포트폴리오 공개

Courtesy of All4Chip

Jae Park 4/24/25 Jae Park 4/24/25

넥스트칩, 차세대 ADAS 솔루션에 Ceva의 뉴프로-M 엣지 AI NPU IP 도입

Courtesy of All4Chip

Jae Park 4/24/25 Jae Park 4/24/25

NEMC announces $1.43m for US start-ups

Courtesy of Compound Semiconductor

Jae Park 4/24/25 Jae Park 4/24/25

The Northeast Microelectronics Coalition awards $1.43 million to 19 semiconductor companies

Courtesy of Silicon Semiconductor

Jae Park 4/23/25 Jae Park 4/23/25

ams OSRAM, 인이어 헤드폰 심박수 측정 지원하는 초소형 칩 LED 발표

Courtesy of elec4

Jae Park 4/22/25 Jae Park 4/22/25

Smart and compact sensors with Edge-AI

Courtesy of Silicon Semiconductor

Jae Park 4/21/25 Jae Park 4/21/25

ACM 리서치, 대용량 팬아웃 패널 레벨 패키징 솔루션의 혁신으로 기술 활성화 부문 수상

Courtesy of Semiconductor Network

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INDUSTRY NEWS

Korean American Semiconductor Professional Alliance (KASPA)