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로옴, OBC 디팩토 스탠다드 위한 높은 전력 밀도의 신형 SiC 모듈 발표
Apr 25
Written By
Jae Park
Courtesy of All4Chip
Jae Park
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마이크로칩, 아날로그 센서 설계 간소화하는 MCU 발표
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인텔, 멀티 노드 칩렛 아키텍처 기반의 차세대 SoC로 차량 혁신 가속화