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Jae Park 7/10/25 Jae Park 7/10/25

Scientists break GaN HEMT limits using novel gate dielectric

Courtesy of Compound Semiconductor

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Jae Park 7/8/25 Jae Park 7/8/25

Japanese team prepares to make SiC from chip waste

Courtesy of Compound Semiconductor

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Jae Park 7/8/25 Jae Park 7/8/25

Perspective on SerDes and CPO: PCB Material and Signal Routing Challenges Ahead

Courtesy of SEMIVISION

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Jae Park 6/26/25 Jae Park 6/26/25

Improving Machine Vision Efficiency with Global Shutter Image Sensor Technology / 글로벌 셔터 이미지 센서 기술로 머신 비전 효율성 향상

Courtesy of All4Chip (Korean Language)

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Jae Park 6/24/25 Jae Park 6/24/25

Hyperspectral Imaging Inspection System Rates Tomato Taste (Podcast)

Courtesy of Vision Systems Design

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Jae Park 6/23/25 Jae Park 6/23/25

AI and International Trade Insights from the 2024 WTO Report

Courtesy of AIPressRoom

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Jae Park 6/23/25 Jae Park 6/23/25

Generative AI’s Impact on Semiconductor Demand in 2024 Insights

Courtesy of AIPressRoom

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Jae Park 6/21/25 Jae Park 6/21/25

Machine Intelligence on Wireless Edge Networks with RF Analog Architecture (MIT, Duke)

Courtesy of Semiconductor Engineering

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Jae Park 6/19/25 Jae Park 6/19/25

Power Delivery Challenges For AI Chips

Courtesy of Semiconductor Engineering

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Jae Park 6/18/25 Jae Park 6/18/25

Researchers discover LED 'Efficiency Cliff'

Courtesy of Compound Semiconductor

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Jae Park 6/18/25 Jae Park 6/18/25

Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission

Courtesy of Silicon Semiconductor

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Jae Park 6/18/25 Jae Park 6/18/25

Veeco announces 2D semiconductor breakthrough

Courtesy of Compound Semiconductor

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Jae Park 6/17/25 Jae Park 6/17/25

Researchers discover LED 'Efficiency Cliff'

Courtesy of Compound Semiconductor

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Jae Park 6/17/25 Jae Park 6/17/25

Vertical GaN diode shows resistance to proton irradiation

Courtesy of Compound Semiconductor

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Jae Park 6/16/25 Jae Park 6/16/25

GaN-on-Si MOSHEMT sets new record

Courtesy of Compound Semiconductor

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Jae Park 6/12/25 Jae Park 6/12/25

Debut for vertical rutile GeO₂ Schottky barrier diode

Courtesy of Compound Semiconductor

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Jae Park 6/12/25 Jae Park 6/12/25

GaN Meets SiC for Megahertz-Class High-Voltage Power (Podcast)

Courtesy of Power Electronics News

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Jae Park 6/10/25 Jae Park 6/10/25

Fraunhofer team makes InP-on-GaAs wafers up to 150 mm

Courtesy of Compound Semiconductor

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Jae Park 6/10/25 Jae Park 6/10/25

Choose the right lens with Nick Sischka (Podcast)

Courtesy of Vision Systems Design

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Jae Park 6/6/25 Jae Park 6/6/25

100kW Charging Brick, GaN, Energy Harvesting and Motor Control: Power Electronics Week Insights

Courtesy of Power Electronics News

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Korean American Semiconductor Professional Alliance (KASPA)

The Korean American Semiconductor Professional Alliance (KASPA) is a U.S.-based 501(c)(3) nonprofit founded in 2024. We are dedicated to building an inclusive global community for Korean American and allied professionals and students in the semiconductor industry. KASPA promotes knowledge-sharing, career growth, and networking through mentorship, workforce development, scholarships, internships, workshops, and international partnerships—empowering future leaders, driving innovation, and strengthening the global semiconductor ecosystem.

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