Innovating LSI Testing: A Contactless Approach Leveraging Electromagnetic Radiation

The escalating costs and complexities of traditional Large-Scale Integration (LSI) testing methods, which rely on multi-pin fixtures and physical contact with I/O pads, have spurred the search for alternative solutions.

M3 Corporation, collaborating with researchers at the Kanamoto laboratory of Hirosaki University, introduced a novel contactless LSI testing method that intentionally exploits electromagnetic radiation phenomena—typically viewed as undesirable noise—to transmit test data wirelessly.

This approach circumvents the need for expensive probe cards and testers while addressing concerns such as electromagnetic interference (EMI) and irradiation side-channel attacks. In an interview with Power Electronics News, Hiroshi Kamiya, CEO of M3 Corporation and a Ph-D student at Hirosaki University, will explore this innovative approach to LSI testing.