Infineon launches EasyPACK C

Written By Jae Park

Infineon is launching EasyPACK C, the next generation of its EasyPACK package family for fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and UPS that operate under harsh conditions and fluctuating load profiles.

The first products in this new package are SiC power modules that integrate Infineon’s CoolSiC MOSFETs 1200 V G2 and the company’s proprietary .XT interconnection technology. These enable designs with more than 30 percent higher power density and up to 20 times longer lifetime compared to the previous generation of CoolSiC MOSFETs, according to Infineon.

Jae Park
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