OKI advances optical semiconductor integration with CFB

OKI has successfully developed Tiling crystal film bonding (CFB) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology . OKI aims to achieve early commercialization through collaboration with partner companies and universities.