INDUSTRY NEWS

Jae Park 8/1/25 Jae Park 8/1/25

지멘스, EMO 2025서 현장 중심 CNC 프로그래밍 통합 솔루션 발표

Courtesy of elec4

Jae Park 8/1/25 Jae Park 8/1/25

한국요꼬가와, ISEC 2025에서 OT 보안을 위한 통합 솔루션 소개한다

Courtesy of elec4

Jae Park 7/31/25 Jae Park 7/31/25

로옴, 자동차 Zone ECU에 최적인 IPD 개발

Courtesy of elec4

Jae Park 7/30/25 Jae Park 7/30/25

Critical Manufacturing acquires Convanit

Courtesy of Silicon Semiconductor

Jae Park 7/30/25 Jae Park 7/30/25

Influencer sentiment soars as Tesla partners with Samsung for next-gen AI chip

Courtesy of Silicon Semiconductor

Jae Park 7/29/25 Jae Park 7/29/25

Infineon launches 1200V CoolSiC MOSFETs in Q-DPAK

Courtesy of Compound Semiconductor

Jae Park 7/29/25 Jae Park 7/29/25

키사이트, 시놉시스와 TSMC 공정 전환 위한 AI 기반 RF 마이그레이션 솔루션 발표

Courtesy of All4Chip

Jae Park 7/28/25 Jae Park 7/28/25

Macom completes takeover of Wolfspeed RF fab

Courtesy of Compound Semiconductor

Jae Park 7/28/25 Jae Park 7/28/25

Onsemi and Schaeffler expand SiC collaboration

Courtesy of Compound Semiconductor

Jae Park 7/28/25 Jae Park 7/28/25

ST, NXP MEMS 센서 사업 9억5천만 달러에 인수

Courtesy of elec4

Jae Park 7/28/25 Jae Park 7/28/25

Chiplet Summit 2025, 칩렛 기반 반도체 설계의 미래를 조명하다

Courtesy of Semiconductor Network

Jae Park 7/26/25 Jae Park 7/26/25

KD, 반도체 전략 강화 위해 마리아 마르세드 이사로 영입

Courtesy of Semiconductor Network

Jae Park 7/24/25 Jae Park 7/24/25

Pfeiffer presents advanced vacuum solutions at SEMICON India 2025

Courtesy of Silicon Semiconductor

Jae Park 7/24/25 Jae Park 7/24/25

인피니티시마, Metron3D 300mm 인라인 웨이퍼 계측 시스템의 성능 고도화 프로젝트 착수

Courtesy of All4Chip

Jae Park 7/24/25 Jae Park 7/24/25

IFA 2025, 연결과 창조의 허브로… 전 세계 기술이 한자리에

Courtesy of Semiconductor Network

Jae Park 7/23/25 Jae Park 7/23/25

Fraunhofer IPMS and DIVE optimise semiconductor processes

Courtesy of Silicon Semiconductor

Jae Park 7/23/25 Jae Park 7/23/25

미루웨어, NVIDIA, AMD GPU 분할 관리 솔루션 갖춘 INFINITIX와 MOU 체결

Courtesy of All4Chip

Jae Park 7/22/25 Jae Park 7/22/25

[AI 이슈] 성능 좋은 칩의 진짜 기준, ′전력당 성능′이 중요한 이유는

Courtesy of elec4

Jae Park 7/21/25 Jae Park 7/21/25

아이디얼, SuperQ 기술로 실리콘 기반 150V·200V MOSFET 양산 돌입

Courtesy of elec4

Jae Park 7/21/25 Jae Park 7/21/25

Kaynes Semicon, 2025년 7월 인도 최초의 패키징 반도체 칩으로 중요한 이정표 달성 예정

Courtesy of Semiconductor Network

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