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SEMICON Southeast Asia 2025 celebrates 30 years of innovation through collaboration
Jae Park 2/26/25 Jae Park 2/26/25

SEMICON Southeast Asia 2025 celebrates 30 years of innovation through collaboration

Courtesy of Silicon Semiconductor

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인텔, 제온 6 프로세서 기반 AI 및 네트워킹 솔루션 공개
Jae Park 2/26/25 Jae Park 2/26/25

인텔, 제온 6 프로세서 기반 AI 및 네트워킹 솔루션 공개

Courtesy of All4Chip

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TI, 작고 효율적 위성 설계 지원하는 200V GaN FET 게이트 드라이버 발표
Jae Park 2/26/25 Jae Park 2/26/25

TI, 작고 효율적 위성 설계 지원하는 200V GaN FET 게이트 드라이버 발표

Courtesy of elec4

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Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning
Jae Park 2/26/25 Jae Park 2/26/25

Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning

Courtesy of Silicon Semiconductor

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Penn State to establish advanced semiconductor lab
Jae Park 2/26/25 Jae Park 2/26/25

Penn State to establish advanced semiconductor lab

Courtesy of Compound Semiconductor

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NXP to acquire edge AI pioneer Kinara
Jae Park 2/26/25 Jae Park 2/26/25

NXP to acquire edge AI pioneer Kinara

Courtesy of Silicon Semiconductor

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3D Semiconductor Packaging market to reach US$ 43.6 billion by 2034 (Copy)
Jae Park 2/26/25 Jae Park 2/26/25

3D Semiconductor Packaging market to reach US$ 43.6 billion by 2034 (Copy)

Courtesy of Silicon Semiconductor

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코보, 디지키와 유통 계약하고 커넥티비티 및 전력 솔루션 전세계 공급
Jae Park 2/26/25 Jae Park 2/26/25

코보, 디지키와 유통 계약하고 커넥티비티 및 전력 솔루션 전세계 공급

Courtesy of elec4

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Svein-Egil Nielsen joins Nanopower as chair of the board
Jae Park 2/26/25 Jae Park 2/26/25

Svein-Egil Nielsen joins Nanopower as chair of the board

Courtesy of Silicon Semiconductor

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로옴, AI 서버 등 고성능 서버용 파워 MOSFET 개발
Jae Park 2/26/25 Jae Park 2/26/25

로옴, AI 서버 등 고성능 서버용 파워 MOSFET 개발

Courtesy of elec4

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Navitas releases Q4 and FY results
Jae Park 2/25/25 Jae Park 2/25/25

Navitas releases Q4 and FY results

Courtesy of Compound Semiconductor

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Infineon introduces CoolGaN G3 Transistor
Jae Park 2/25/25 Jae Park 2/25/25

Infineon introduces CoolGaN G3 Transistor

Courtesy of Silicon Semiconductor

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다쏘시스템, “3D익스피리언스 월드 2025“개최, AI 기반 생성형 경제의 탐험
Jae Park 2/25/25 Jae Park 2/25/25

다쏘시스템, “3D익스피리언스 월드 2025“개최, AI 기반 생성형 경제의 탐험

Courtesy of All4Chip

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마이크로칩, 소프트웨어 관리 간소화 위한 통합 컴파일러 라이선스 발표
Jae Park 2/25/25 Jae Park 2/25/25

마이크로칩, 소프트웨어 관리 간소화 위한 통합 컴파일러 라이선스 발표

Courtesy of elec4

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다쏘시스템-쿠카(KUKA), 제조업체의 로봇 공학 및 자동화 효율성 향상 위한 파트너십 체결
Jae Park 2/25/25 Jae Park 2/25/25

다쏘시스템-쿠카(KUKA), 제조업체의 로봇 공학 및 자동화 효율성 향상 위한 파트너십 체결

Courtesy of Semiconductor Network

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U-M wins up to $7.5m for heat-tolerant SiC project
Jae Park 2/24/25 Jae Park 2/24/25

U-M wins up to $7.5m for heat-tolerant SiC project

Courtesy of Compound Semiconductor

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램리서치, 뛰어난 충진과 고정밀 증착 구현하는 ALD 장비 공개
Jae Park 2/24/25 Jae Park 2/24/25

램리서치, 뛰어난 충진과 고정밀 증착 구현하는 ALD 장비 공개

Courtesy of elec4

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마이크로칩, 다양한 형태 차량용 디스플레이 위한 터치스크린 컨트롤러 발표
Jae Park 2/24/25 Jae Park 2/24/25

마이크로칩, 다양한 형태 차량용 디스플레이 위한 터치스크린 컨트롤러 발표

Courtesy of elec4

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HPE, 엔비디아 블랙웰 기반 첫 번째 시스템 공식 출하
Jae Park 2/22/25 Jae Park 2/22/25

HPE, 엔비디아 블랙웰 기반 첫 번째 시스템 공식 출하

Courtesy of Semiconductor Network

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마이크로소프트, 세계 최초 토포컨덕터 기반 양자 프로세서 ‘마요라나 1’ 공개
Jae Park 2/21/25 Jae Park 2/21/25

마이크로소프트, 세계 최초 토포컨덕터 기반 양자 프로세서 ‘마요라나 1’ 공개

Courtesy of All4Chip

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Korean American Semiconductor Professional Alliance (KASPA)

The Korean American Semiconductor Professional Alliance (KASPA) is a U.S.-based 501(c)(3) nonprofit founded in 2024. We are dedicated to building an inclusive global community for Korean American and allied professionals and students in the semiconductor industry. KASPA promotes knowledge-sharing, career growth, and networking through mentorship, workforce development, scholarships, internships, workshops, and international partnerships—empowering future leaders, driving innovation, and strengthening the global semiconductor ecosystem.

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