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MACOM signs Preliminary Memorandum of Terms for Federal CHIPS and Science Act funding
Jae Park 1/24/25 Jae Park 1/24/25

MACOM signs Preliminary Memorandum of Terms for Federal CHIPS and Science Act funding

Courtesy of Silicon Semiconductor

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한국오라클, 국내 스타트업 5개사에 AI 기반 서비스 개발 지원한다
Jae Park 1/24/25 Jae Park 1/24/25

한국오라클, 국내 스타트업 5개사에 AI 기반 서비스 개발 지원한다

Courtesy of Semiconductor Network

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Imec, AI와 딥테크 산업의 발전으로 진화하고 있는 반도체 기술의 잠재력 모색
Jae Park 1/24/25 Jae Park 1/24/25

Imec, AI와 딥테크 산업의 발전으로 진화하고 있는 반도체 기술의 잠재력 모색

Courtesy of All4Chip

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EU to invest €3m in GeSi quantum project
Jae Park 1/23/25 Jae Park 1/23/25

EU to invest €3m in GeSi quantum project

Courtesy of Compound Semiconductor

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New chip to solve quantum computing roadblocks
Jae Park 1/23/25 Jae Park 1/23/25

New chip to solve quantum computing roadblocks

Courtesy of Silicon Semiconductor

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다나까귀금속공업, 전력반도체용 시트 형상 접합 재료 개발
Jae Park 1/23/25 Jae Park 1/23/25

다나까귀금속공업, 전력반도체용 시트 형상 접합 재료 개발

Courtesy of elec4

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도시바, 모터 제어용 Arm Cortex-M4 기반 MCU 라인업 확장
Jae Park 1/23/25 Jae Park 1/23/25

도시바, 모터 제어용 Arm Cortex-M4 기반 MCU 라인업 확장

Courtesy of elec4

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PC 출하량, 지난해 1.3% 증가에 이어 AI PC 가치 상승으로 올해에도 성장세 전망
Jae Park 1/22/25 Jae Park 1/22/25

PC 출하량, 지난해 1.3% 증가에 이어 AI PC 가치 상승으로 올해에도 성장세 전망

Courtesy of All4Chip

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Turbocharging the GaN MOSFET with a HfO₂ gate
Jae Park 1/22/25 Jae Park 1/22/25

Turbocharging the GaN MOSFET with a HfO₂ gate

Courtesy of Compound Semiconductor

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벨킨, 보관 및 이동 효율성을 모두 갖춘 ‘트래블 충전 솔루션’ 공개
Jae Park 1/22/25 Jae Park 1/22/25

벨킨, 보관 및 이동 효율성을 모두 갖춘 ‘트래블 충전 솔루션’ 공개

Courtesy of All4Chip

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Wolfspeed launches new Gen 4 MOSFET technology
Jae Park 1/22/25 Jae Park 1/22/25

Wolfspeed launches new Gen 4 MOSFET technology

Courtesy of Compound Semiconductor

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에이수스, NVIDIA Jetson Orin 플랫폼으로 구동되는 IoT edge AI 컴퓨터, Super 모드 추가 지원으로 AI 성능 향상 발표
Jae Park 1/22/25 Jae Park 1/22/25

에이수스, NVIDIA Jetson Orin 플랫폼으로 구동되는 IoT edge AI 컴퓨터, Super 모드 추가 지원으로 AI 성능 향상 발표

Courtesy of All4Chip

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IEEE Electronic Components and Technology Conference highlights Best & Outstanding Papers from ECTC 2024
Jae Park 1/22/25 Jae Park 1/22/25

IEEE Electronic Components and Technology Conference highlights Best & Outstanding Papers from ECTC 2024

Courtesy of Silicon Semiconductor

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마우저, 이튼 전기사업부를 포함한 이튼 코퍼레이션과의 글로벌 유통 계약 확대
Jae Park 1/22/25 Jae Park 1/22/25

마우저, 이튼 전기사업부를 포함한 이튼 코퍼레이션과의 글로벌 유통 계약 확대

Courtesy of All4Chip

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Element Six unveils Cu-diamond composite
Jae Park 1/22/25 Jae Park 1/22/25

Element Six unveils Cu-diamond composite

Courtesy of Compound Semiconductor

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인텔 파운드리, 18A 테스트 칩 단계 돌입으로 미국 국방 분야에서 역할 증대
Jae Park 1/21/25 Jae Park 1/21/25

인텔 파운드리, 18A 테스트 칩 단계 돌입으로 미국 국방 분야에서 역할 증대

Courtesy of elec4

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Lynred launches Eyesential SWIR sensor for machine vision
Jae Park 1/21/25 Jae Park 1/21/25

Lynred launches Eyesential SWIR sensor for machine vision

Courtesy of Compound Semiconductor

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Keysight expands chiplet interconnect standards support
Jae Park 1/21/25 Jae Park 1/21/25

Keysight expands chiplet interconnect standards support

Courtesy of Silicon Semiconductor

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2025년 전기차 시장 17% 성장, 불확실성 확대로 차량 제조사 우선 전략 재고 가능
Jae Park 1/21/25 Jae Park 1/21/25

2025년 전기차 시장 17% 성장, 불확실성 확대로 차량 제조사 우선 전략 재고 가능

Courtesy of All4Chip

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SemiQ announces hi-rel 1700V SiC MOSFETs
Jae Park 1/21/25 Jae Park 1/21/25

SemiQ announces hi-rel 1700V SiC MOSFETs

Courtesy of Compound Semiconductor

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Korean American Semiconductor Professional Alliance (KASPA)

The Korean American Semiconductor Professional Alliance (KASPA) is a U.S.-based 501(c)(3) nonprofit founded in 2024. We are dedicated to building an inclusive global community for Korean American and allied professionals and students in the semiconductor industry. KASPA promotes knowledge-sharing, career growth, and networking through mentorship, workforce development, scholarships, internships, workshops, and international partnerships—empowering future leaders, driving innovation, and strengthening the global semiconductor ecosystem.

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