DesignCon 2026 – Where the Chip Meets the Board
DesignCon 2026, known as “where the chip meets the board,” took place this week in Santa Clara, and I had the pleasure of attending at the invitation of KOTRA Silicon Valley.
Founded in 1962, KOTRA (Korea Trade-Investment Promotion Agency) is a South Korean government organization dedicated to promoting international trade, foreign investment, and global business partnerships. Through its Silicon Valley office, KOTRA continues to play a key role in connecting innovative Korean companies with the global technology ecosystem.
This year, with KOTRA’s support, several leading Korean companies showcased their latest technologies at DesignCon, highlighting advancements across semiconductor packaging, interconnects, cooling, and test solutions.
KOTRA’s Featured Companies
Daeduck Electronics is a leading provider of advanced printed circuit boards (PCBs) and semiconductor substrates. The company specializes in high-density interconnect (HDI) boards and IC substrates such as FCBGA and FCCSP, which are critical for high-performance computing, mobile devices, and AI applications. Its high-layer-count HDI and advanced substrate technologies are designed to deliver superior signal integrity, reliability, and performance for next-generation semiconductor packaging.
KoolMicro is addressing one of the industry’s biggest challenges… thermal management in high-power computing systems. Its Integrated Manifold Microchannel (IMMC) direct liquid cooling technology enables ultra-high heat flux dissipation of up to 2,000 W/cm². This breakthrough approach allows efficient cooling of advanced AI processors and high-power semiconductors, supporting the growing demands of data centers and accelerated computing.
Uniqconn is innovating at the intersection of connectivity and semiconductor design. Its UC60S10 single-chip solution delivers gigabit-class, low-latency wireless communication over short distances, effectively replacing traditional wired interfaces. By eliminating physical connectors and cables, Uniqconn enables more flexible system architectures for AI, data centers, and next-generation computing platforms.
In addition to the featured companies, KOTRA’s strategic partners also exhibited at DesignCon, further demonstrating the depth of Korea’s semiconductor ecosystem.
KOTRA’s Strategic Partners
Huwin provides advanced semiconductor packaging and interconnect solutions, focusing on high-precision substrates and components that support high-performance and next-generation computing applications.
Leeno Industrial is a leading supplier of IC test sockets and probe solutions, enabling reliable and accurate testing across semiconductor development and mass production. Its solutions play a critical role in ensuring device performance and yield.
Withwave specializes in high-frequency and millimeter-wave connectivity solutions, delivering high-speed signal transmission capabilities essential for advanced semiconductor devices, 5G infrastructure, and AI systems.
TSE provides precision test interface solutions, including probe cards and test sockets, supporting efficient and high-throughput semiconductor validation in manufacturing environments.
Event Highlights and Trends
DesignCon 2026 highlighted several key trends shaping the semiconductor industry. The event underscored the increasing demand for high-speed connectivity and low-latency interconnects, as well as the growing importance of advanced thermal management solutions for high-power AI and data center applications. Attendees also saw significant advances in IC substrate and PCB technology that support next-generation computing performance, along with the emergence of wireless solutions that can replace traditional wired interfaces, enabling more flexible and efficient system architectures.
KOTRA-supported Korean companies are making a global impact by delivering cutting-edge technologies that enable high-performance computing, efficient thermal management, and seamless connectivity across AI, data centers, and advanced electronics.
KASPA Closing Thoughts
It was exciting to visit these booths and see firsthand how these companies are advancing technologies that power today’s digital infrastructure. From AI processors and high-speed connectivity to thermal management and semiconductor testing, their innovations highlight the critical role of the broader ecosystem in enabling next-generation computing.
Events like DesignCon provide a platform for global collaboration and innovation, connecting companies, researchers, and engineers who are solving the complex challenges of modern electronics. We look forward to seeing how these Korean companies continue to drive innovation in the global semiconductor ecosystem
Source: Korean American Semiconductor Professional Alliance (KASPA)