KASPA Newsletter
Quarterly Newsletter
July 2026 Edition
Welcome to our July Edition!
Building Stronger Global Connections Across the Semiconductor Ecosystem
As the semiconductor industry continues to evolve through artificial intelligence, advanced packaging, next-generation computing, and global collaboration, KASPA remains committed to connecting professionals, fostering partnerships, and expanding educational opportunities across the international semiconductor community.
This month, we are pleased to share new strategic partnerships, industry insights, leadership perspectives, educational initiatives, and upcoming events that continue to strengthen our mission of advancing the Korea-US semiconductor ecosystem while building meaningful relationships around the world.
KASPA and Team of Wakers Sign Strategic MOU
KASPA has officially signed a Memorandum of Understanding (MOU) with Team of Wakers to strengthen collaboration between Korea and the United States across the semiconductor, AI, and deep-tech sectors.
The partnership combines KASPA's semiconductor expertise, industry network, and policy insights with Team of Wakers' startup acceleration experience and Silicon Valley ecosystem engagement.
Together, the organizations will support startups, entrepreneurs, and innovators through:
Ecosystem connectivity and networking
U.S. market access guidance
Founder, investor, and industry expert engagement
Cross-border innovation programs
Future international collaboration opportunities
As Team of Wakers expands its international initiatives, including future engagement with Japan, KASPA looks forward to exploring additional opportunities that strengthen the global innovation ecosystem.
KASPA x TECHEX IoT Expo 2026
As an official Media Partner, KASPA attended the TECHEX IoT Expo 2026 at the San Jose McEnery Convention Center.
The event showcased innovations across:
Edge AI
Industrial IoT
Connected infrastructure
AI-enabled automation
Secure and scalable IoT deployments
One of the strongest themes observed throughout the exhibition was the increasing convergence of AI, semiconductor technologies, and industrial digital transformation, highlighting the growing importance of cross-industry collaboration.
Building the Future of Semiconductor Innovation
As artificial intelligence reshapes semiconductor development, collaboration between global engineering communities has never been more important.
South Korea continues to lead the world in memory semiconductors, advanced manufacturing, packaging technologies, and fabrication through companies such as Samsung Electronics and SK hynix.
Meanwhile, India has become one of the world's largest semiconductor engineering and R&D hubs, supporting global innovation through extensive design, verification, embedded systems, and AI software development.
Together, these complementary strengths create exciting opportunities across:
AI semiconductors
Advanced packaging and HBM memory
Automotive electronics
Data center infrastructure
Semiconductor R&D
Workforce development
The future semiconductor ecosystem will be built through global collaboration, and Korea and India are well positioned to help shape the next generation of innovation.
The Future of Semiconductor Innovation and Leadership
KASPA recently published an executive interview featuring Eric Bouche, Founder and Managing Director of Silicon Valley Research Initiative.
Drawing upon more than three decades of semiconductor leadership, Eric shares valuable insights into:
The evolution of semiconductor innovation
AI accelerators and advanced packaging
Global engineering collaboration
Healthcare applications enabled by semiconductors
Leadership in complex technology organizations
Skills needed for future semiconductor professionals
Responsible innovation and long-term industry impact
The interview also reflects on his leadership experiences with KLA-Tencor, Systems on Silicon Manufacturing Company (SSMC), NEC Semiconductors, and Philips Semiconductors.
AI Infra Summit 2026
KASPA is proud to serve as an official Media Partner for AI Infra Summit 2026. September 15-17, 2026, Santa Clara Convention Center, Santa Clara, CA
Now entering its ninth year, AI Infra Summit brings together more than 8,000 professionals building the infrastructure that powers artificial intelligence, from semiconductor chips and advanced networking to storage, interconnects, and next-generation data centers.
Featured keynote speakers include Jeff Dean, Ian Buck, Lip-Bu Tan, Santosh Janardhan, and Fidelma Russo. Additional speakers will be announced in the coming weeks.
With nearly 500 additional seats added to the main stage, organizers anticipate tickets will sell out significantly earlier this year.
As an official Media Partner, KASPA has secured an exclusive 15% discount on Full Conference and VIP passes. Please email koamspa@gmail.com for promotional code.
Registration: https://www.ai-infra-summit.com/2026-registration
Expo-only passes are also available through the event organizers.
Semiconductor Education Program
Together with Sahita Technologies, KASPA members receive 15% Discount. Courses include:
Semiconductor Ecosystem Overview
Semiconductor Quality Management
Semiconductor Supply Chain
Visit: https://www.koamspa.com/learning-center to learn more.
Email: koamspa@gmail.com to receive your member discount code.
AIS 2026 Member Discount
KASPA members receive an exclusive promotional discount for AIS 2026. The conference brings together innovators, researchers, and industry leaders exploring:
Sensors
Sensing technologies
Transducers
Artificial Intelligence
Visit: www.sciforum.net/event/AIS2026
Email: koamspa@gmail.com to request your discount code.
Learn 5G and 6G with 6G Academy
KASPA has partnered with 6G Academy to strengthen the future semiconductor workforce through world-class telecommunications education. Members receive:
20% off Pro+ Annual Membership
20% off individual 5G courses
20% off individual 6G courses
Visit: https://www.koamspa.com/learning-center to learn more.
Email: koamspa@gmail.com to receive your exclusive discount code.
June 2026
KASPA x Team of Wakers join forces to strengthen Korea–U.S. innovation bridge for semiconductors, AI, and deep tech.
May 2026
KASPA was named the official Media Partner for the 5th Constructing Next-Gen Data Centers Europe conference, expanding our engagement within the global data center and semiconductor infrastructure ecosystem.
May 2026
KASPA named official Media Partner for the AI Infra Summit 2026.
April 2026
KASPA announced its education partnership with Sahita Technologies to provide professional semiconductor training and exclusive member discounts.
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