What an exciting and productive week at the OCP Global Summit 2026 in San Jose, California!
From October 12-15, KASPA had the opportunity to connect with industry leaders, technology innovators, and key players across the global semiconductor, AI infrastructure, data center, and open computing ecosystems.
A major highlight of our participation was visiting leading South Korean technology companies and exploring their latest products, demonstrations, and innovations. We were particularly impressed by the technologies showcased by Samsung Electronics, SK hynix, and FADU, each demonstrating important advancements addressing the evolving demands of next-generation AI infrastructure.
Samsung Electronics – Advancing AI Memory and Computing
Samsung showcased innovative memory and computing solutions designed to address the growing demands of AI workloads, including:
AI Memory Node with CMM-D: Demonstrating memory expansion and pooling capabilities to support more efficient AI infrastructure.
KV Cache Solutions: Showcasing how CMM-D pooling and the CMM-D MD310 enable scalable memory expansion and improved memory utilization for agentic AI workloads.
AI Tokenization Solutions: Highlighting technologies supporting AI accelerator and edge AI applications, including LPDDR5X-PIM.
Advanced Memory Technologies: Showcasing high-bandwidth memory (HBM), processing-in-memory (PIM), and key-value cache optimization to address increasing memory capacity and data-processing requirements.
Samsung also highlighted its collaboration with AMD in advancing next-generation AI memory and computing technologies. Their work on CXL-based memory expansion and pooling addresses an important infrastructure challenge by enabling more flexible memory scaling across servers, particularly for demanding AI inference workloads.
SK hynix – Enabling the Next Generation of AI Infrastructure
SK hynix showcased practical applications of AI through next-generation, solution-focused system demonstrations, highlighting the role of advanced memory technologies in high-performance computing and AI data centers.
Its participation emphasized:
Demonstrating innovative memory solutions and their practical applications in AI infrastructure.
Highlighting collaboration opportunities with strategic technology partners and data center operators.
Exploring emerging industry trends and next-generation infrastructure requirements.
Identifying opportunities to strengthen technology strategies, complement existing capabilities, and support future business growth.
These demonstrations reinforced the critical role of advanced memory technologies in enabling scalable, high-performance AI systems.
FADU – Four Technologies. One Goal: More Efficient AI Infrastructure.
FADU presented an impressive portfolio of storage, controller, cooling, and power technologies designed to meet the increasing performance and efficiency requirements of AI data centers.
Key highlights included:
Gen6 Controller & SSD: Next-generation PCIe Gen6 performance and power efficiency designed to support increasingly demanding AI workloads.
File-Semantic SSD (FS-SSD): Introduced as the world's first File-Semantic SSD, enabling file-aware storage operations directly within the SSD to reduce host CPU overhead and improve overall system efficiency.
Liquid Cooling: SSD cold-plate technology enabling direct, device-level cooling to address the growing thermal demands of high-performance storage.
Power & Signal Solutions: Advanced power management and high-speed signal technologies designed to improve energy efficiency and signal integrity across AI server infrastructure.
Together, these innovations demonstrate FADU's commitment to advancing smarter, more efficient, and scalable storage solutions for next-generation AI data centers.
Connecting Korean Innovation with Global Opportunities
Our visits provided valuable insight into South Korea's growing role in the global technology ecosystem and highlighted the country's strengths in semiconductor innovation, engineering excellence, advanced memory, and next-generation storage technologies.
Beyond the product demonstrations, the summit provided an excellent opportunity to exchange industry perspectives, explore emerging technologies, strengthen relationships, and identify potential areas for collaboration between Korean technology companies and the broader international ecosystem.
At KASPA, we believe that connecting innovative Korean companies with global markets, facilitating strategic partnerships, and creating opportunities for cross-border collaboration are essential to advancing the next generation of technology.
We sincerely appreciate everyone who took the time to meet with us, share their innovations, and exchange ideas during the summit. We look forward to building on these connections and turning promising conversations into meaningful partnerships.
Thank you, OCP Global Summit 2026! We look forward to what comes next.
Source: Korean American Semiconductor Professional Alliance (KASPA)